BS EN 61249-2-36-2009 PDF

Full title and description

STB / BS EN 61249-2-36:2009 — Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad — Epoxide woven E‑glass laminate sheets of defined flammability (vertical burning test), copper‑clad for lead‑free assembly.

Abstract

This standard specifies requirements and test criteria for copper‑clad epoxide laminates reinforced with woven E‑glass, intended as base materials for printed circuit boards (PCBs) and other interconnecting structures. It includes material and construction requirements (resin system, metal foil, reinforcement), electrical and non‑electrical property classes, internal marking and a set of test methods including a vertical burning (flammability) test. The standard is published as EN 61249‑2‑36:2009 and is technically identical to IEC 61249‑2‑36:2008.

General information

• Status: Published / listed as active; some catalogues indicate the record is under review for revision monitoring.
• Publication date: 30 June 2009 (EN publication / BSI listing).
• Publisher: British Standards Institution (national adoption of EN 61249‑2‑36:2009). The normative text is part of the EN/IEC family for electrical standards.
• ICS / categories: 31.180 — Printed circuits and boards.
• Edition / version: EN 61249‑2‑36:2009 (implements IEC 61249‑2‑36:2008 as the European adoption).
• Number of pages: 28 pages (BSI product listing and multiple standards catalogues).

Scope

Defines the characteristics, dimensional and performance requirements, and test methods for copper‑clad, epoxide resin, woven E‑glass laminate sheets intended for printed circuit board manufacture and lead‑free assembly. Typical provisions cover resin system types, foil type and thickness, reinforcement architecture, thickness ranges (commonly from about 0.05 mm to approximately 3.20 mm in product families), specified glass transition temperature classes (e.g., Tg ≥ 120 °C) and flammability classification by vertical burning tests; several property requirements are grouped into performance classes to be specified at the time of order.

Key topics and requirements

• Material composition and construction: resin system (difunctional halogen‑containing epoxy typical), reinforcement (woven E‑glass) and metal foil specifications.
• Electrical properties: dielectric parameters and test requirements relevant for PCB substrates.
• Non‑electrical properties: surface appearance (pits, dents, wrinkles, scratches, raised areas, waviness), dimensional tolerances, laminate thickness and unclad face quality.
• Thermal/mechanical performance: glass transition temperature classes (minimum Tg requirements), thermal stability and suitability for lead‑free assembly processes.
• Flammability: defined vertical burning test criteria determining the material’s flame performance class.
• Marking, ordering information and performance classes: designation of the required property class must be stated by the purchaser to avoid mis‑delivery.
• Test methods and acceptance criteria: standardized test procedures for verification of listed properties.

Typical use and users

Used by PCB material manufacturers, laminate suppliers, printed circuit board fabricators, OEMs specifying substrate materials for electronic assemblies (particularly lead‑free processes), procurement and quality engineers, and testing/approval laboratories responsible for material qualification and supplier acceptance. It is referenced in specifications where defined flammability and lead‑free assembly compatibility are required.

Related standards

Part of the IEC/EN 61249 series covering materials for printed boards and interconnecting structures. This part (2‑36) is aligned with IEC 61249‑2‑36:2008. Other related standards include additional EN/IEC parts addressing different laminate/prepreg constructions and international test methods for flammability and thermal performance used in PCB material qualification. Users typically check adjacent parts of EN/IEC 61249 and national adoptions for companion requirements.

Keywords

Reinforced materials; Epoxide; E‑glass; Laminates; Copper‑clad; Printed‑circuit bases; Flammability; Lead‑free assembly; Tg; Sheet materials; PCB substrates.

FAQ

Q: What is this standard?

A: EN/BS EN 61249‑2‑36:2009 is a specification for copper‑clad, epoxide resin, woven E‑glass laminate sheets with defined flammability characteristics intended as base materials for printed circuit boards and similar interconnecting structures.

Q: What does it cover?

A: It covers material composition, construction details, electrical and non‑electrical properties, thermal performance (including Tg classes), flammability by vertical burning test, marking and ordering information, test methods and acceptance criteria for the specified laminates.

Q: Who typically uses it?

A: PCB laminate manufacturers and suppliers, printed‑circuit fabricators, OEMs and procurement/quality engineers who must specify, buy or test PCB substrate materials suitable for lead‑free assembly and with defined flame performance. Test laboratories and certification bodies also use it for material verification.

Q: Is it current or superseded?

A: The document is published as EN 61249‑2‑36:2009 (adopting IEC 61249‑2‑36:2008). Catalogues and standards providers list it as current/active, while some reseller databases flag the record as 'under review' for monitoring — users should verify the current status with their national standards body (e.g., BSI) before relying on it for new procurements.

Q: Is it part of a series?

A: Yes — it is one part of the EN/IEC 61249 series (Materials for printed boards and other interconnecting structures). Other parts of the series cover different base materials, prepregs and related substrate constructions.

Q: What are the key keywords?

A: Reinforced materials; Epoxide; E‑glass; Copper‑clad; Laminates; PCB substrates; Flammability; Lead‑free assembly; Tg.