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Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2- Mitigation of deleterious effects of tin. Original standard IEC TS 62647-2-2012 in PDF full version. Additional info + preview on request

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Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21- Program management - Systems engineering guidelines for managing the transition to lead-free electronics. Original standard IEC TS 62647-21-2013 in PDF full version. Additional info + preview on request

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Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22- Technical guidelines. Original standard IEC TS 62647-22-2013 in PDF full version. Additional info + preview on request

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Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23- Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies. Original standard IEC TS 62647-23-2013 in PDF full version. Additional info + preview on request

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Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3- Performance testing for systems containing lead-free solder and finishes. IEC TS 62647-3:2014-02(en). Original standard IEC TS 62647-3-2014 in PDF full version. Additional info + preview on request

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Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4- Ball grid array (BGA) re-balling. IEC TS 62647-4:2018-04(en). Original standard IEC TS 62647-4-2018 in PDF full version. Additional info + preview on request

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