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Mechanical standardization of semiconductor devices - Part 2: Dimensions. Original standard IEC 60191-2X-1999 сor1-2000 in PDF full version. Additional info + preview on request

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Twenty-third supplement - Mechanical standardization of semiconductor devices - Part 2- Dimensions. Original standard IEC 60191-2Y-2000 in PDF full version. Additional info + preview on request

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Twenty-fourth supplement - Mechanical standardization of semiconductor devices - Part 2- Dimensions. Original standard IEC 60191-2Z-2000 in PDF full version. Additional info + preview on request

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Mechanical standardization of semiconductor devices - Part 3- General rules for the preparation of outline drawings of integrated circuits. CEI/IEC 60191-3:1999. Original standard IEC 60191-3-1999 in PDF full version. Additional info + preview on request

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Mechanical standardization of semiconductor devices - Part 4- Coding system and classification into forms of package outlines for semiconductor device packages. IEC 60191-4:2013-10+AMD1:2018-03 CSV(en-fr). Original standard IEC 60191-4-2018 in PDF full version. Additional info + preview on request

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Mechanical standardization of semiconductor devices - Part 5- Recommendations applying to integrated circuit packages using tape automated bonding (TAB). CEI/IEC 60191-5:1997. Original standard IEC 60191-5-1997 in PDF full version. Additional info + preview on request

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